Application Number 4831573 (Class 7)
Application Number:4831573
Status:
Unknown
Class:7
Applicant: TOKYO SEIMITSU CO., LTD
Filing Date:Fri, 22 Jan 2021
In Progress
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Trademark Information
| Trademark | |
| Trademark Type | Wordmark |
| Class | 7 |
| Application Number | 4831573 |
| Nature/Scope of business | hemical machines, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor manufacturing equipment, namely wire slicing machines, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, dicing machines, and chemical mechanical planarizers; and machine parts and tools therefor; Automatic distribution vending machines. |
| Publication | In Journal No. 2082 |
| Status | Unknown |
| Applicant: | TOKYO SEIMITSU CO., LTD |
| Applicant Address | 2968-2, Ishikawa-machi, Hachioji-shi, Tokyo 192-8515, Japan. A corporation organized and existing under the laws of Japan. |
| Jurisdiction | MUMBAI |
| Agent | KRISHNA & SAURASTRI ASSOCIATES LLP |
| Agent Address | 74/F, VENUS, WORLI SEA FACE, MUMBAI – 400018 |
Frequently Asked Questions
Who is the owner of trademark application number 4831573? ▾
The trademark application number 4831573 is owned by TOKYO SEIMITSU CO., LTD.
Which class does trademark application number 4831573 belong to? ▾
Trademark application number 4831573 is filed under Class 7, which relates to the specified goods and services.
Who is the trademark agent for application 4831573? ▾
The trademark agent associated with application number 4831573 is KRISHNA & SAURASTRI ASSOCIATES LLP.
Was trademark application number 4831573 published in the journal? ▾
Yes, trademark application number 4831573 was published in Journal No. 2082.
What is trademark application number 4831573? ▾
Trademark application number 4831573 relates to "hemical machines, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor manufacturing equipment, namely wire slicing machines, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, dicing machines, and chemical mechanical planarizers; and machine parts and tools therefor; Automatic distribution vending machines.".
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