Application Number 2055782 (Class 7)
Application Number:2055782
Status:
UNKNOWN
Class:7
Applicant: ASTI HOLDINGS LIMITED
Filing Date:Fri, 19 Nov 2010
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Trademark Information
| Trademark | |
| Trademark Type | Wordmark |
| Class | 7 |
| Application Number | 2055782 |
| Nature/Scope of business | Machines used in the semiconductor manufacturing and processing industry for inter alia, automolding, singulating, encapsulation, ball placement, flip chip bonding, testing, inspection, packing; flip chip bonding machines; semiconductor or wafer level inspection machines; scan-pack machines; tape and reel machines and sorter machines. |
| Publication | In Journal No. 1693 |
| Status | UNKNOWN |
| Applicant: | ASTI HOLDINGS LIMITED |
| Applicant Address | trading as ;ASTI HOLDINGS LIMITED 25 Kallang Avenue, # 06-01 Kallang Basin Industrial Estate, Singapore 339416 Manufacturer, merchant and service providers |
| Jurisdiction | CHENNAI |
| Agent | R.K. DEWAN & CO. |
| Agent Address | PODAR CHAMBERS, S.A. BRELVI ROAD, FORT, MUMBAI - 400 001. |
Frequently Asked Questions
What is the status of trademark application number 2055782? ▾
The trademark application number 2055782 is currently marked as "UNKNOWN" in the official trademark registry.
Who is the owner of trademark application number 2055782? ▾
The trademark application number 2055782 is owned by ASTI HOLDINGS LIMITED.
Which class does trademark application number 2055782 belong to? ▾
Trademark application number 2055782 is filed under Class 7, which relates to the specified goods and services.
Who is the trademark agent for application 2055782? ▾
The trademark agent associated with application number 2055782 is R.K. DEWAN & CO..
Was trademark application number 2055782 published in the journal? ▾
Yes, trademark application number 2055782 was published in Journal No. 1693.
What is trademark application number 2055782? ▾
Trademark application number 2055782 relates to "Machines used in the semiconductor manufacturing and processing industry for inter alia, automolding, singulating, encapsulation, ball placement, flip chip bonding, testing, inspection, packing; flip chip bonding machines; semiconductor or wafer level inspection machines; scan-pack machines; tape and reel machines and sorter machines.".
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