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Application Number:2947113
Status:
UNKNOWN
Class:40
Filing Date:Tue, 21 Apr 2015

Trademark Information

Trademark
Trademark TypeWordmark
Class40
Application Number2947113
Nature/Scope of businessCustom assembling of materials for others; Assembling and encapsulation services for wafers, semiconductor, integrated circuits (for others); Manufacture and processing of wafers, semiconductor, integrated circuits (for others); Lithographing, etching, filming, proliferation, ion implantation and chemical or Mechanical abrasion services for silicon wafer (for others); Cutting, molding and etchings services for wafers, semiconductor, integrated circuits (for other); Assembling of photomasks of integrated circuits and electronic or computer chips for others.
PublicationIn Journal No. 1786
Status
UNKNOWN
Applicant: WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Applicant AddressNo.18 Gaoxin Si Road, East-lake High-tech Development Zone, Wuhan, China Service Providers A company organized and existing under the laws of China
JurisdictionDELHI
AgentZEUSIP
Agent AddressC-4 JANGPURA EXTENSION NEW DELHI-110014

Frequently Asked Questions

What is the status of trademark application number 2947113?
The trademark application number 2947113 is currently marked as "UNKNOWN" in the official trademark registry.
Who is the owner of trademark application number 2947113?
The trademark application number 2947113 is owned by WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD..
Which class does trademark application number 2947113 belong to?
Trademark application number 2947113 is filed under Class 40, which relates to the specified goods and services.
Who is the trademark agent for application 2947113?
The trademark agent associated with application number 2947113 is ZEUSIP.
Was trademark application number 2947113 published in the journal?
Yes, trademark application number 2947113 was published in Journal No. 1786.
What is trademark application number 2947113?
Trademark application number 2947113 relates to "Custom assembling of materials for others; Assembling and encapsulation services for wafers, semiconductor, integrated circuits (for others); Manufacture and processing of wafers, semiconductor, integrated circuits (for others); Lithographing, etching, filming, proliferation, ion implantation and chemical or Mechanical abrasion services for silicon wafer (for others); Cutting, molding and etchings services for wafers, semiconductor, integrated circuits (for other); Assembling of photomasks of integrated circuits and electronic or computer chips for others.".

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