TDK (Class 9)

The trademark application number 3324601 is currently marked as "DRAFT" in the official trademark registry.

The trademark application number 3324601 is owned by TDK KABUSHIKI KAISHA (TDK CORPORATION).

Trademark application number 3324601 is filed under Class 9, which relates to the specified goods and services.

The trademark agent associated with application number 3324601 is DEPENNING & DEPENNING.

Yes, trademark application number 3324601 was published in Journal No. 1776.

Trademark application number 3324601 relates to "Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; compact discs, DVDs and other digital recording media; mechanisms for coin-operated apparatus; cash registers, calculating machines, data processing equipment, computers; computer software; fire-extinguishing apparatus,housemark for a full line of electrical engineering and electronic devices for the telecommunications, automotive electronics and industrial and consumer electronics industries; electrical engineering and/or electronic devices for the telecommunications, automotive electronics and industrial and/or consumer electronics industries; electric/electronic parts; electric/electronic devices; electric/electronic components; electric/electronic materials; electric/electronic passive components; ceramic components; microwave ceramics; capacitors; ceramic capacitors; multilayer ceramic capacitors; assembled elements composed of capacitors; EMC (electromagnetic compatibility) components; ferrite beads; ceramic beads; chip beads; electrical/electronic filters; filters for electrical signals; filters to control signal frequencies; filters for radio interference suppression; EMC (electromagnetic compatibility) filters;3-terminal filters; common mode filters; chokes; choke Coils; common mode choke coils; differential mode choke coils; peaking coils; molded coils; varistors; clamp filters (ferrite core with case); ferrites; ferrite materials; ferrite cores;dielectric filters;ceramic filters;piezoelectric filters;ferrite beads filters; noise filters;inductors; coils; transformers; electrical/electronic transformers; pulse transformers;current transformers; noise suppressing sheets;magnetic sheets;electro-magnetic absorbing and shielding materials; micro wave absorbers;electromagnetic absorbers; radio wave absorbers; high frequency magnetic substances; anechoic chambers;equipments/devices for EMC (electromagnetic compatibility) test system, sold individually or in units;sensors;temperature measurement sensors;thermistors;NTC (negative temperature coefficient) thermistors;PTC (positive temperature coefficient) thermistors;temperature responsive reed switches;humidity sensors;surface potential sensors; gear tooth sensors; gear tooth sensors for angle sensing; gear tooth sensors for speed sensing; mechanical sensors; toner concentration/residual volume sensors; powder level sensors; door open/shut sensors; switches for door latch; electromagnetic sensors;actuators;plungers;plungers[part of machines];mechanical drive components;nebulizers;nebulizer units; ultrasonic nebulizer units;humidifier for mist generation system;pumps;piezoelectric components;piezoelectric products;piezoelectric ceramic filters;resonators;resonant circuits;ceramic resonators; sounding bodies;piezoelectric receivers;piezoelectric buzzers;electromagnetic buzzers;piezoelectric actuators;magnetostrictive resonators;discriminators;ceramic discriminators;thermal print heads;thin film thermal heads; recording/reproducing heads;magnetic heads;thin film magnetic heads;memory controllers;non-volatile memory controllers; flash memory controllers;NAND flash memory controllers;flash memory; memory cards;flash memory cards;non-volatile memory;non- volatile memory cards;CF (compact flash) cards;CF (compact flash) card for industrial applications;SSD (solid state drive);SSD (solid state drive) for industrial applications;semiconductor devices;semiconductor memories;memory card adopters;displays; organic light emitting displays;light emitting diodes;organic light emitting diodes;RF(radio frequency) components;antennas;ceramic patch antennas;ceramic chip antennas;multilayer chip antennas;band pass filters;dielectric band pass filters;circulators;circulators for base stations;isolators;isolators for base stations;multiplexers;diplexers;multilayer diplexers;multilayer band pass filters;thin-Film band pass filters; phase shifters;multilayer phase shifters;delay lines;strip lines;low pass filters;multilayer low pass filters; high pass filters;multilayer high pass filters;baluns;balun transformers;multilayer balun transformers; thin film balun transformers;couplers;directional couplers;multilayer directional couplers;LAN (local area network) components;wireless LAN (local area network) modules;devices for wireless radio transmission; wireless telephony apparatus;electric/electronic resisters;double balance mixers;terminators;transducers; accelerometers;electrodes;magnets;ferrite magnets;plastic bonded magnets;rubber bonded magnets; magnets sheets;magnetic cores;magnetic materials;power supplies;AC (alternate current) input power supplies;DC (direct current) to DC (direct current) converters;DC (direct current) to AC (alternate current) inverters; switching power supplies;noise filters;UPS (uninterruptible power systems);solar cells;film solar cells;inverters;inverter ballasts;fluorescent lamp ballast for electric lights; converters; factory automation systems;wafer processing equipment;semiconductor manufacturing equipment;FOUP Load Port (station for supporting a semiconductor wafer transporting container where the cover of the transporting container is separated or separable from the transporting container);flip chip mounting machine;flip chip dispensers;component inserting machines;bulk feeding machines;components sequencing machines; laser marking systems;chip component mounting machines;IC (integrated circuits);circuit boards;IC (integrated circuits)".