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Application Number:7516504
Status:
Ready for Examination
Class:99
Filing Date:Tue, 10 Feb 2026

Trademark Information

TrademarkSamsung 2.3D Cube-E
Trademark TypeWordmark
Class99
Application Number7516504
Nature/Scope of business[CLASS : 9] Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets. [CLASS : 40] Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others. [CLASS : 42] Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing.
Status
Ready for Examination
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Applicant Address129, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
JurisdictionCHENNAI
AgentDEPENNING & DEPENNING[879]
Agent Address120, VELACHERY MAIN ROAD, GUINDY, CHENNAI - 600 032.

Frequently Asked Questions

What is the status of trademark Samsung 2.3D Cube-E? ▾
The trademark application number 7516504 is currently marked as "Ready for Examination" in the official trademark registry.
Who is the owner of trademark Samsung 2.3D Cube-E? ▾
The trademark application number 7516504 is owned by SAMSUNG ELECTRONICS CO., LTD..
Which class does trademark Samsung 2.3D Cube-E belong to? ▾
Trademark application number 7516504 is filed under Class 99, which relates to the specified goods and services.
Who is the trademark agent for application 7516504? ▾
The trademark agent associated with application number 7516504 is DEPENNING & DEPENNING[879].
What is trademark Samsung 2.3D Cube-E? ▾
Trademark application number 7516504 relates to "[CLASS : 9] Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets. [CLASS : 40] Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others. [CLASS : 42] Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing.".

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