
| Trademark | Samsung 2.3D Cube-E |
| Trademark Type | Wordmark |
| Class | 99 |
| Application Number | 7516504 |
| Nature/Scope of business | [CLASS : 9] Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets. [CLASS : 40] Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others. [CLASS : 42] Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing. |
| Status | Ready for Examination |
| Applicant: | SAMSUNG ELECTRONICS CO., LTD. |
| Applicant Address | 129, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea |
| Jurisdiction | CHENNAI |
| Agent | DEPENNING & DEPENNING[879] |
| Agent Address | 120, VELACHERY MAIN ROAD, GUINDY, CHENNAI - 600 032. |
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