
| Trademark | HEAT-SPRING |
| Trademark Type | Wordmark |
| Class | 6 |
| Application Number | 2111255 |
| Nature/Scope of business | THERMALLY CONDUCTIVE METAL FOILS FOR IMPROVING THERMAL INTERFACES BETWEEN SEMICONDUCTOR AND ELECTRICAL COMPONENTS REGISTRATION OF THIS TRADE MARK SHALL GIVE NO RIGHT TO THE EXCLUSIVE USE OF THE.HEAT.. |
| Publication | In Journal No. 1826 |
| Status | DRAFT |
| Applicant: | INDIUM CORPORATION OF AMERICA |
| Applicant Address | 34 ROBINSON ROAD, CLINTON, NY 13323, U.S.A. SERVICES INDIUM CORPORATION OF AMERICA, A NEW YORK CORPORATION USA, |
| Jurisdiction | DELHI |
| Agent | REMFRY & SAGAR |
| Agent Address | REMFRY HOUSE AT THE MILLENNIUM PLAZA SECTOR 27 GURGAON-122002 |
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