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Application Number:7831808
Status: Formalities Chk Pass
Class:99
Applicant:(1) CoolSem Technologies Holding B.V. Body Incorporate
Filing Date:Tue, 07 Apr 2026
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Trademark Information

TrademarkDevice
Trademark TypeImage (Device)
Class99
Application Number7831808
Nature/Scope of business[CLASS : 9] Electric and electronic components; electrical circuits and printed circuit boards; III-V thin-film devices; wafers for integrated circuits; coolers for electronic components; photonic chips; photonic integrated circuits (PICs); indium phosphide chips and semiconductors; III-V semiconductors; chips for integrated circuits; semiconductor lasers; microprocessors; semi-conductor devices; semi-conductor chips; semiconductor modules; semiconductor substrates; semiconductor sensors; semiconductor transistors; thin-film materials, namely thermally conductive, optical, and electrically functional layers for application on semiconductors, optical components, and wafers; thin-film devices manufactured from III-V materials, with thermal functions, including for applications in photonics, radio frequency, and power electronics; electronic and optoelectronic components with integrated thin-film layers for thermal management or signal processing; integrated circuits (ICs); interfaces; electronic chips for the manufacture of integrated circuits. [CLASS : 40] Material processing on wafers, semiconductors, and optical components, including the application of thin-film layers; processing of semiconductor wafers; semiconductor encapsulation; applying a thin film layer to optical components; processing of electronic components to optimize heat dissipation and performance; applying thermally conductive or heat-dissipating layers to electronic components; material processing, namely substrate separation and removal of electronic or optoelectronic components; customer-specific manufacturing of semiconductor wafers, semiconductor circuits, semiconductor components, devices, and circuits. [CLASS : 42] Scientific and technological services; product development; designing semiconductor chips; research and development of photonic products; research in the field of semiconductor processing technology; consultancy, design, research, development, production and advisory services related thereto in the field of semiconductor chips; technical advice regarding the production of semiconductors; research and development of substrate removal processes, thin-film coating processes, thermal integration, and management of electrical and electronic components; development and implementation of thermally, optically and electrically functional thin-film materials; designing semiconductor chips, lasers, transistors, PICs and integral circuits; technical research and consultancy related thereto in the field of the manufacturing of photonic silicon chips; development of software for (photonic) semiconductors; development of software for simulation, analysis, and process control of thin-film technology and thermal management.
PublicationIn Journal No.
Status Formalities Chk Pass
Applicant:(1) CoolSem Technologies Holding B.V. Body Incorporate
Applicant AddressHigh Tech Campus 9 NL-5656 AE Eindhoven Netherlands
JurisdictionIR DIVISION

Frequently Asked Questions

What is the status of trademark Device?
The trademark application number 7831808 is currently marked as "Formalities Chk Pass" in the official trademark registry.
Who is the owner of trademark Device?
The trademark application number 7831808 is owned by (1) CoolSem Technologies Holding B.V. Body Incorporate.
Which class does trademark Device belong to?
Trademark application number 7831808 is filed under Class 99, which relates to the specified goods and services.
What is trademark Device?
Trademark application number 7831808 relates to "[CLASS : 9] Electric and electronic components; electrical circuits and printed circuit boards; III-V thin-film devices; wafers for integrated circuits; coolers for electronic components; photonic chips; photonic integrated circuits (PICs); indium phosphide chips and semiconductors; III-V semiconductors; chips for integrated circuits; semiconductor lasers; microprocessors; semi-conductor devices; semi-conductor chips; semiconductor modules; semiconductor substrates; semiconductor sensors; semiconductor transistors; thin-film materials, namely thermally conductive, optical, and electrically functional layers for application on semiconductors, optical components, and wafers; thin-film devices manufactured from III-V materials, with thermal functions, including for applications in photonics, radio frequency, and power electronics; electronic and optoelectronic components with integrated thin-film layers for thermal management or signal processing; integrated circuits (ICs); interfaces; electronic chips for the manufacture of integrated circuits. [CLASS : 40] Material processing on wafers, semiconductors, and optical components, including the application of thin-film layers; processing of semiconductor wafers; semiconductor encapsulation; applying a thin film layer to optical components; processing of electronic components to optimize heat dissipation and performance; applying thermally conductive or heat-dissipating layers to electronic components; material processing, namely substrate separation and removal of electronic or optoelectronic components; customer-specific manufacturing of semiconductor wafers, semiconductor circuits, semiconductor components, devices, and circuits. [CLASS : 42] Scientific and technological services; product development; designing semiconductor chips; research and development of photonic products; research in the field of semiconductor processing technology; consultancy, design, research, development, production and advisory services related thereto in the field of semiconductor chips; technical advice regarding the production of semiconductors; research and development of substrate removal processes, thin-film coating processes, thermal integration, and management of electrical and electronic components; development and implementation of thermally, optically and electrically functional thin-film materials; designing semiconductor chips, lasers, transistors, PICs and integral circuits; technical research and consultancy related thereto in the field of the manufacturing of photonic silicon chips; development of software for (photonic) semiconductors; development of software for simulation, analysis, and process control of thin-film technology and thermal management.".

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